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JCID Chip underfill

JCID Chip underfill

13,55 EUR
incl. VAT / Pcs.
Regular price / Pcs.
Size
standard
Product on order
Product on order
Free and fast delivery from 59,58 EUR
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JCID UF6008 Nand Chip Fill Adhesive.

 


JCID UF6008 Chip Underfill is a highly reliable and efficient adhesive solution for Nand chips. With its outstanding properties including fast and uniform diffusion, automatic curing. The use of UF6008 JCID increases adhesion, improves drop resistance, reduces the risk of patching, extends the life of the device.

Brand
PhoneParts
Symbol
2000000054247
Producer code
2000000054247
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