JCID Chip underfill
JCID Chip underfill
JCID UF6008 Nand Chip Fill Adhesive.
JCID UF6008 Chip Underfill is a highly reliable and efficient adhesive solution for Nand chips. With its outstanding properties including fast and uniform diffusion, automatic curing. The use of UF6008 JCID increases adhesion, improves drop resistance, reduces the risk of patching, extends the life of the device.
Brand
Entity responsible for this product in the EU
M.P. Dystrybucja sp. z o.o.More
Address:
Zuchów 11Postal code: 43-200City: PszczynaCountry: Polska
Symbol
2000000054247
Producer code
2000000054247
Producer
PhoneParts
Product type
Spare parts
Condition
New
Ask a question
Write your opinion
Not confirmed by purchase
Score: /5
Not confirmed by purchase
Score: /5
Not confirmed by purchase
Score: /5