Wholesale customers are welcome to b2b.monstelo.com
Free delivery from 58,33 EUR
Language and currency:
en | EUR
Country of collecting the order:
Poland
0,00 EUR
JCID Chip underfill

JCID Chip underfill

13,27 EUR
incl. VAT / Pcs.
Regular price / Pcs.
Size
standard
Product on order
Product on order
Free and fast delivery from 58,33 EUR
14 days for easy returns
This product is not available in a stationary store
Safe shopping
Product sold out
You will receive an email notification from us when the product is available again.
Data is processed in accordance with the privacy policy. By submitting data, you accept privacy policy provisions.
Contact details entered above are not used to send newsletters or other advertisements. When you sign up to be notified, you hereby agree to receive only a one-time notification of a product re-availability.

JCID UF6008 Nand Chip Fill Adhesive.

 


JCID UF6008 Chip Underfill is a highly reliable and efficient adhesive solution for Nand chips. With its outstanding properties including fast and uniform diffusion, automatic curing. The use of UF6008 JCID increases adhesion, improves drop resistance, reduces the risk of patching, extends the life of the device.

Brand
PhoneParts
Symbol
2000000054247
Producer code
2000000054247
Do you need help? Do you have any questions?Ask a question and we'll respond promptly, publishing the most interesting questions and answers for others.
Ask a question
Ask a question
If this description is not sufficient, please send us a question to this product. We will reply as soon as possible. Data is processed in accordance with the privacy policy. By submitting data, you accept privacy policy provisions.
Write your opinion
Your opinion:
5/5
Add your own product photo:
Real customers reviews
4.7 / 5.0 1043 reviews
pixelpixelpixelpixelpixel